3DIC Compiler

The Industry’s Only Unified Exploration-to-Signoff Platform for 2.5D and 3D Multi-Die Designs

Synopsys 3DIC Compiler, a unified exploration-to-signoff platform, delivers the highest levels of design efficiency for capacity and performance. It leverages a single data-model to integrate design, die-to-die routing, test and silicon lifecycle management, native system analysis, verification, and signoff in a single environment. Synopsys 3DSO.ai, industry's first autonomous AI optimization solution for 2.5D and 3D heterogeneous design and integration, seamlessly integrates with 3DIC Compiler to maximize system performance and quality of results at a rapid pace for thermal integrity, signal integrity, and power network design. Ensuring system technology co-optimization (STCO), Synopsys 3DIC Compiler is certified by all foundries and leveraged successfully by customers in dozens of designs.


Key Benefits

Unmatched Scalability
System-of-chips integration over hundreds of billions of transistors
High Productivity
Fast exploration and design using world-class implementation and analysis engines
Golden Signoff
Full spectrum design closure and convergence to optimal PPA/mm3

What's New

Explore our library of news, blogs, webinars and other helpful resources.

<p>In this session, industry luminaries from AMD, Intel, Qualcomm, Stanford University discuss emerging usage of 3DIC across multiple verticals, including HPC, datacenter and mobile. Hear insights on its abundant promise, challenges, and how to move this exciting technology faster and further into the design ecosystem and normalize it as a go-to methodology.</p>

3DIC Design Panel
Crossing Over from Buzz to Adoption

In this session, industry luminaries from AMD, Intel, Qualcomm, Stanford University discuss emerging usage of 3DIC across multiple verticals, including HPC, datacenter and mobile. Hear insights on its abundant promise, challenges, and how to move this exciting technology faster and further into the design ecosystem and normalize it as a go-to methodology.

Latest Videos

Chairman and co-CEO Aart de Geus highlights the scalability, optimality, and verifiability of Synopsys’ 3DIC Solution in this excerpt from the  ISSCC keynote "Catalysts of the Impossible: Silicon, Software, and Smarts for the Era of SysMoore”.

Shankar Krishnamoorthy, GM, Silicon Realization Group, discusses how multi-die design is now being used in various market segments to overcome system challenges. 

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