Signal contacts are arranged horizontally in highspeed differential pairs for zero skew. This makes your board design simpler, while increasing signal integrity performance and saving board space. Each differential pair is surrounded by six ground connection points.
The connector allows for 1.5mm worth of mating separation (between both the ground and signal) through TE’s C-shaped, 360-grounding design, which includes an extra “orphan” shield at the bottom of the horizontal stack of contacts for complete shielding. The 360-ground shield provides high signal integrity margin, (electrical margin) granting you more chip and PCB flexibility. C-shaped shields protrude outwards to protect signal pins from damage.
Tabs on the sides of C-shield assure that ground contacts have at least a 2.5mm wipe, which helps maintain electrical performance with 1.5mm of un-mate condition.