3D X-DRAMTM
World’s First 3D NAND-like DRAM
3D X-DRAM is a game-changing technology. It uses innovative Floating Body Cell (FBC) and, stores data as electric charges using one transistor and no capacitor. 3D X-DRAM has a simple structure and small cell size, like 3D NAND flash memory, making manufacturing and scaling easy and less expensive than other 3D DRAM solutions. The estimated capacity of 3D X-DRAM capacity is 128 Gb for 230 layers, which is, eight times higher density than ordinary DRAM.
3D X-DRAM Cell Structure
Based on Floating Body Cell Technology
3D X-DRAM
2D Floating Body Cell
3D X-DRAM
Array Structure
3D NAND-like
Array and Process
The Future of
DRAM Technology
The top curve shows the estimated density of 3D X-DRAM based on the roadmap of the existing 3D NAND technology. Because 3D X-DRAM manufacturing process is extremely similar to 3D NAND, the 3D X-DRAM density will increase along with the increase of number in 3D NAND layers. The actual density of 3D X-DRAM is dependent on the advancement of 3D NAND process at that time.
